High-Speed Signal Propagation[c] Advanced Black Magic  

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• 1. Main Page

• 2. Table of content

• 3. Copyright

  Copyright Dedication

• 4. Prentice Hall Modern Semiconductor Design Series

  Design-For-Test For Digital IC s and Embedded Core Systems design for test for digital ic s and embedded core systems notes

• 5. Preface

  Preface

• 6. Note from the Author

  Note from the Author

• 7. Topics Covered

  Topics Covered

• 8. How This Book Is Organized

  How This Book Is Organized

• 9. Prerequisites

  Prerequisites

• 10. Relation to Prior Books

  Relation to Prior Books

• 11. Acknowledgements

  Acknowledgements

• 12. Notational Conventions

  Notational Conventions

• 13. Contacting the Author

  Contacting the Author

• 14. Glossary of Special Symbols

  Glossary of Special Symbols

• 15. Units and Special Constants

• 16. Time-Dependent and Frequency-Dependent Variables

• 17. Transmission-Line Parameters

• 18. AC-Transmission-Line Parameters Specified at Frequency w

• 19. Material Parameters

• 20. General Notation

• 21. Chapter 1. Fundamentals

  Chapter 1. Fundamentals

• 22. 1.1 Impedance of Linear, Time-Invariant, Lumped-Element Circuits

  1.1 Impedance of Linear Time-Invariant Lumped-Element Circuits

• 23. 1.2 Power Ratios

  Historical note 1.2 Power Ratios

• 24. 1.3 Rules of Scaling

  1.3 Rules of Scaling

• 25. 1.4 The Concept of Resonance

  A Child s Playground Swing Set 1.4 The Concept of Resonance

• 26. 1.5 Extra for Experts: Maximal Linear System Response to a Digital Input

  1.5 Extra for Experts: Maximal Linear System Response to a Digital Input

• 27. Chapter 2. Transmission Line Parameters

  Chapter 2. Transmission Line Parameters

• 28. 2.1 Telegrapher s Equations

  TEM Wave Configuration Article first published in EDN Magazine July 5 2001 2.1 Telegrapher s Equations

• 29. 2.2 Derivation of Telegrapher s Equations

  Signals Flow Both Ways 2.2 Derivation of Telegrapher s Equations

• 30. 2.3 Ideal Transmission Line

  2.3 Ideal Transmission Line

• 31. 2.4 DC Resistance

  2.4 DC Resistance

• 32. 2.5 DC Conductance

  2.5 DC Conductance

• 33. 2.6 Skin Effect

  2.6 Skin Effect

• 34. 2.7 Skin-Effect Inductance

  2.7 Skin-Effect Inductance

• 35. 2.8 Modeling Internal Impedance

  2.8 Modeling Internal Impedance

• 36. 2.9 Concentric-Ring Skin-Effect Model

  Article first published in EDN Magazine April 12 2001 Email correspondence received July 17 2001 SE-HO YOU writes Reply 2.9 Concentric-Ring Skin-Effect Model

• 37. 2.10 Proximity Effect

  The long, straight wire in the figure has a current i = 2.11 A flowing in it.

• 38. 2.11 Surface Roughness

  2.11 Surface Roughness

• 39. 2.12 Dielectric Effects

  Critical frequency for conducting Versus Insulating Mode Network Function Relations 2.12 Dielectric Effects

• 40. 2.13 Impedance in Series with the Return Path

  2.13 Impedance in Series with the Return Path

• 41. 2.14 Slow-Wave Mode On-Chip

  2.14 Slow-Wave Mode On-Chip

• 42. Chapter 3. Performance Regions

  Chapter 3. Performance Regions

• 43. 3.1 Signal Propagation Model

  3.1 Signal Propagation Model

• 44. 3.2 Hierarchy of Regions

  Article first published in EDN Magazine April 4 2002 3.2 Hierarchy of Regions

• 45. 3.3 Necessary Mathematics: Input Impedance and Transfer Function

  3.3 Necessary Mathematics: Input Impedance and Transfer Function

• 46. 3.4 Lumped-Element Region

  3.4 Lumped-Element Region

• 47. 3.5 RC Region

  3.5 RC Region

• 48. 3.6 LC Region (Constant-Loss Region)

  3.6 LC Region (Constant-Loss Region)

• 49. 3.7 Skin-Effect Region

  3.7 Skin-Effect Region

• 50. 3.8 Dielectric Loss Region

  3.8 Dielectric Loss Region

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